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劉兌現博士報告會《60-GHz封裝應用的孔腔耦合貼片天線設計》預告

來源: 電院網絡中心2011-11-30 23:04:22瀏覽次數:

報告題目：60-GHz封裝應用的孔腔耦合貼片天線設計
Aperture-Coupled Patch Antenna Designs for 60-GHz Package Applications
報告人：劉兌現 博士（Dr. Duixian Liu）, IEEE Fellow
        T. J. Watson Research Center, IBM
報告時間：2011年12月2日14:30～16:00
報告地點：電子工程學院學術報告廳（主樓III區241）

Bio:


Duixian Liu received the B.S. degree in electrical engineering from XiDian University, Xi’an, China, in 1982, and the M.S. and Ph.D. degrees in electrical engineering from the Ohio State University, Columbus, in 1986 and 1990, respectively.

From 1990 to 1996, he was with Valor Enterprises Inc. Piqua, Ohio, initially as an Electrical Engineer and then as the Chief Engineer, during which time he designed an antenna product line ranging from 3 MHz to 2.4 GHz for the company, a very important factor for the prestigious Presidential “E” Award for Excellence in Exporting in 1994. Since April 1996, he has been with the IBM T. J. Watson Research Center, Yorktown Heights, NY, as a Research Staff Member. He has received three IBM’s Outstanding Technical Achievement Awards and one Corporate Award, the IBM's highest technical award. He was named Master Inventor in 2007. He has edited a book titled Advanced Millimeter-wave Technologies - Antennas, Packaging and Circuits published in 2009 by Wiley. He has authored or coauthored approximately 100 journal and conference papers. He has 38 patents issued and 20 patents pending. His research interests are antenna design, EM modeling, chip packaging, digital signal processing, and communications technologies.

Dr. Liu is a Fellow of IEEE and an associate editor for the IEEE Transactions on Antennas and Propagation and a Guest Editor for the IEEE Transactions on Antennas & Propagation special issues on Antennas and Propagation Aspects of 60-90 GHz Wireless Communications (October 2009) and upcomimg Antennas and Propagation at mm- and sub mm-waves (April 2013). He has been an organizer or chair for numerous international conference sessions or special sessions and served as a technical program committee member for many international conferences. He was the general chair of the 2006 IEEE International Workshop on Antenna Technology: Small Antennas and Novel Metamaterials, White Plains, New York. He has served as an external Ph.D. examiner for several universities and external examiner for government organizations on research grants.